Other Customized Automation
AOI machine for Wire-bond
Equipment use
This equipment performs
Quality visual inspection of wire-bonding on COB using machine vision system.
Dot marking on NG devices and purge.
Configuration
UPH > 3,000
Positioning repeatability ±0.01mm
Pixel: 5,000,000
Intelligent features
Ease of device inspection change-over, simply load the new device inspection plan from the system.
Capable to scan product code from top or bottom/back side.
Machine architecture
The equipment is designed for both standalone and scalable in-line production operations.
It is clean-room class 100 or ISO 5 ready.
Device input feeder.
Machine vision inspection station.
Dot Marking & purge module.
FG Output feeder.