Other Customized Automation
3D Bracket bonding machine
Equipment use
This equipment performs
Alignment between 3D bracket and Camera module
Bonding process between 3D bracket and Camera module.
Laser height check to confirm quality.
Configuration
UPH：550
Positioning repeatability ±0.01mm
Pixel: 5,000,000
Intelligent features
Programmable dispensing parameters; such as feed rate, stop time, thickness control (z-axis); for all type of adhesive shape requirement.
Automatic placement positioning compensation via machine vision systems, integrated triple pick & place module.
Machine architecture
The equipment is designed for both standalone and scalable in-line production operations.
It is clean-room class 100 or ISO 5 ready.
Bracket input feeder.
Camera module input feeder.
Pick & place module.
6 stations turn-table.
Machine vision system.
Point A dispensing station.
Point B dispensing station
UV cure and Laser height measuring station.
Unloading & re-check station.
Reject bin.
Output stacker