Universal monitoring burn-in tester for DRAM and flash packages.

By controlling each temperature zone under different conditions, customers are able to maximize system utilization during reliability verification tests. 

The system has the ability to test all functional items

Target protocols: SRAM, DRAM (DDR, LPDDR, GDDR) Flash memory (NOR, NAND, EMMC, etc.), MCP   

Target shape: BGA burn-in test jack of all types

Temperature range: -40℃~125℃ (optional temperature box）