Other Customized Automation
Dual Devices AA bonding machine
Equipment use
This equipment performs.
Optimize optical and image quality for 2 devices using active alignment (AA).
Fixation or pre-cure bonding process of 2 devices onto metal bracket.
Configuration
UPH : 270
Up to 6 Degree of freedom alignment
Parallelism at ±0.08°
Intersecting angle at < 0.05°
Intelligent features
Capable of dot and line dispensing, consistency at 99.8%.
Programmable dispensing parameters; such as feed rate, stop time, thickness control (z-axis); for all type of adhesive shape requirement.
Automatic placement positioning compensation via machine vision systems, integrated triple pick & place module.
Machine architecture
The equipment is designed for both standalone and scalable in-line production operations.
It is clean-room class 100 or ISO 5 ready.
Device A input feeder.
Device B Input feeder.
Metal Bracket Input feeder.
Triple pick & place with CCD positioning module.
Dual Dispensing and UV cure pick & place modules.
Dual Active Alignment (AA) stations.
CCD Vision systems and laser height measurement.
FG Output module.