Other Customized Automation
Single Device AA bonding machine
Equipment use
This equipment performs.
Optimize optical and image quality of a single device using active alignment (AA).
Fixation or pre-cure bonding of Lens VCM module onto the Sensor.
Configuration
UPH : 400
Up to 6 Degree of freedom alignment
Intelligent features
Single or multiple point marking for same or different defined action/s on the same product.
Capable of dot and line dispensing.
Programmable dispensing parameters; such as feed rate, stop time, thickness control (z-axis); for all type of adhesive shape requirement.
Automatic placement positioning compensation via machine vision systems.
Machine architecture
The equipment is designed for both standalone and scalable in-line production operations.
It is clean-room class 100 or ISO 5 ready.
Input A feeder - Sensor.
Input B feeder – Lens module.
CCD Vision systems.
Pick & Place for A – Sensor.
Adhesive dispensing and UV curing station.
Dual Active Alignment stations
FG Output module.